教學大綱與進度

課程基本資料：

學年期	課號	課程名稱	階段	學分	時數	修	教師	班級	人	撤	備註
108-2	273177	半導體製程	1	3.0	3	★	胡心卉	電子四甲 電子四乙 電子三甲 電子三乙	33	1	電子三、四甲乙合開

教學大綱與進度：

教師姓名	胡心卉
Email	hhhu@ntut.edu.tw
最後更新時間	2019-12-18 15:25:03
課程大綱	1.Introduction to Semiconductor Engineering 2.Semiconductor Fundamental 3.Wafer Manufacturing 4.Cleanroom, Clearn and Gettering 5.Thermal Oxidation 6.Diffusion 7.Ion Implantation 8.Etching 9.Deposition 10.Lithography
課程進度	1.Introduction to Semiconductor Engineering 2.Semiconductor Fundamental 3.Semiconductor Fundamental 4.Wafer Manufacturing 5.Cleanroom, Clearn and Gettering 6.Thermal Oxidation 7.Diffusion 8.Ion Implantation 9.Mid-term Exam 10.Etching 11.Deposition 12.Lithography 13.Lithography 14.上機實習 15.上機實習 16.上機實習 17.Final Exam 18.Final report
評量方式與標準	Attendance (10%) Mid-term Exam (20%) Final Exam (30%) Final Project (40%)
使用教材、參考書目或其他	【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：是 [1] Hong Xiao, “Introduction to Semiconductor Manufacturing Technology”, 2000, Prentice Hall [2] James D. Plummer, M. D. Deal, and P. B. Griffin, “Silicon VLSI Technology-Fundamentals, Practice and Modeling”, 2000, Prentice Hall. [3] Stanley Wolf and Richard N. Tauber “Silicon Processing for the VLSI ERA, Volume1: Process Technology”, 1986, Lattice Press. [4] W. R. Runyan and K. E. Bean “Semiconductor Integrated Circuit Processing Technology”, 1990, Addison-Wesley. [5] James W. Mayer and Sylvanus S. Lau “Electronic Materials Science: For Integrated Circuits in SI and GaAs”, 1989, Prentice Hall.
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