教學大綱與進度

課程基本資料：

學年期	課號	課程名稱	階段	學分	時數	修	教師	班級	人	撤	備註
113-2	345376	前瞻半導體元件製造與物理	1	3.0	3	★	洪英傑	化工四甲 化工四乙 化工四丙	12	0	大四化工所合開

教學大綱與進度：

教師姓名	洪英傑　教師諮商時間(Office Hours)
Email	hungyc@ntut.edu.tw
最後更新時間	2024-12-20 17:12:53
課程大綱	本課程之目的在於介紹一些廣泛、基本及實際的半導體製造程序（其中最主要者為積體電路之製造程序）。 一、半導體基礎知識 1.1 半導體材料和性質 - 摻雜物質和半導體的導電性 - 能隙和能帶結構 1.2 基本的半導體器件 - 晶體二極體（Diode） - 金屬氧化物半導體場效應電晶體（MOSFET） 二、半導體製程步驟 2.1 前端製程 - 晶圓製備 - 形成氧化層 - 光阻和光刻技術 - 擴散和離子佈植 2.2 中後段製程 - 金屬化和化學機械研磨（CMP） - 絕緣層和封裝 - 測試和製程控制 三、先進製程技術 3.1 先進製程的發展趨勢 3.2 三維製程技術 3.3 極紫外線（EUV）製程 四、製程模擬和製程控制 4.1 製程模擬工具的應用 4.2 製程監控和優化 4.3 製程變異性和缺陷控制 五、產業應用與趨勢 5.1 半導體產業概況 5.2 新興應用領域 5.3 綠色製程和可持續性 I. Semiconductor Fundamentals 1.1 Semiconductor Materials and Properties Dopant Materials and Semiconductor Conductivity Energy Band Gap and Band Structure 1.2 Basic Semiconductor Devices Crystal Diode (Diode) Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) II. Semiconductor Manufacturing Steps 2.1 Front-End Processing Wafer Preparation Oxide Layer Formation Photoresist and Photolithography Techniques Diffusion and Ion Implantation 2.2 Middle-Back-End Processing Metallization and Chemical Mechanical Polishing (CMP) Insulation Layer and Packaging Testing and Process Control III. Advanced Manufacturing Technologies 3.1 Trends in Advanced Manufacturing 3.2 Three-Dimensional Manufacturing Technology 3.3 Extreme Ultraviolet (EUV) Manufacturing Process IV. Process Simulation and Control 4.1 Application of Process Simulation Tools 4.2 Process Monitoring and Optimization 4.3 Process Variability and Defect Control V. Industry Applications and Trends 5.1 Over
課程進度	Week 1 I. Semiconductor Fundamentals 1.1 Semiconductor Materials and Properties Dopant Materials and Semiconductor Conductivity Energy Band Gap and Band Structure Week 2 Basic Semiconductor Devices Crystal Diode (Diode) Week 3 Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) & Physics Week 4 Semiconductor Manufacturing Steps 2.1 Front-End Processing Wafer Preparation Oxide Layer Formation Week 5 Photoresist and Photolithography Techniques Week 6 Diffusion and Ion Implantation 2.2 Middle-Back-End Processing Week 7 Metallization and Chemical Mechanical Polishing (CMP) Week 8 Insulation Layer and Packaging Week 9 Midterm Week 10 Testing and Process Control & Process Monitoring and Optimization & Defect Control III. Advanced Manufacturing Technologies Week 11 Trends in Advanced Manufacturing 3.2 Three-Dimensional Manufacturing Technology Week 12 Extreme Ultraviolet (EUV) Manufacturing Process IV. Process Simulation and Control Week 13 Application of Process Simulation Tools V. Industry Applications and Trends Week 14 Overview of the Semiconductor Industry Week 15 Presentation I Week 16 Presentation II Week 17 Presentation III Week 18 Final Exam
評量方式與標準	25% Midterm 25% Final Exam 50 % Presentation
使用教材、參考書目或其他	【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：否 半導體製程技術導論(第四版) 蕭宏
課程諮詢管道	Email: hungyc@ntut.edu.tw
課程對應SDGs指標	SDG1：消除貧窮（No Poverty） SDG3：良好健康和福祉（Good Health and Well-being） SDG4：優質教育（Quality Education） SDG10：減少不平等（Reduced Inequalities）
課程是否導入AI
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