| 課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
|---|---|---|---|---|
| 7305082 | 半導體構裝技術 | Semiconductor and Microelectronic Packaging Technology | 2.0 | 2 |
| 中文概述 Chinese Description | 半導體晶片封裝及微電子元件構裝技術是將積體電路和其它電元件，依設計聯結在一系統中，再以構裝材料將晶片、基座及釘架封包。本課程將介紹陶瓷構裝和高分子構裝、及其相關技術、與工業現況。 | |||
| 英文概述 English Description | Semiconductor chip packaging and microelectronic packaging is the critical technology to allow the chips be incorporated into an individual protective package, mounted with other components in hybrid or multichip modules, or connected directly onto a printed circuit board. This course will introduce both ceramic packaging and polymer packaging and their corresponding technology. | |||
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