課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
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4005098 | 高等IC製程 | Advanced Integrated Circuit Fabrication Process | 3.0 | 3 |
中文概述 Chinese Description | 深入探討最新的IC製程技術,包含前段的加熱、離子植入、物理沈積、化學沈積、微影、蝕刻等製程,及後段的各種封裝技術及測試方法,並介紹其研究方向、製程與元件物理的關係及製程整合的技術。 | |||
英文概述 English Description | Study the state of the art of the IC fabrication processes, including heating, ion implant, PVD, CVD, lithograph, etching of the front-end processes and packaging and testing of back-end processes. The trends of the processes, the relationship of the processes with the physics of the devices and the process integrating technology will also be taught in this course. |
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