| 課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
|---|---|---|---|---|
| 3501021 | 半導體分子材料與製程檢測 | Semiconductor molecular materials and fabrication testing | 2.0 | 2 |
| 中文概述 Chinese Description | 本課程分為三大重點：(1) 製程涵蓋：半導體基礎原理、晶圓製造、加熱製程、蝕刻製程、化學氣相沉積、金屬化製程、製程整合技術。(2) 分析涵蓋：晶相結構分析、奈米3D顯微形貌表面形態分析、原子力顯微鏡。(3) 業界講師共同授課並分享產業為來發展趨勢。 | |||
| 英文概述 English Description | The course is divided into three main points: (1) The fabrication: basic principles of semiconductor, wafer manufacturing, heating process, etching process, chemical vapor deposition, metallization process, and process integration technology. (2) Analysis: crystal structure analysis, nano 3D micro-topography and surface morphology analysis, atomic force microscope. (3) Industry lecturers teach and share industry trends in the future. | |||
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