| 課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
|---|---|---|---|---|
| 3314139 | 元件構裝 | Electronic Packaging Technology for Semiconductor Devices | 3.0 | 3 |
| 中文概述 Chinese Description | 隨著積體電路的微小化及系統功能的整合化趨勢，元件構裝是將微小的積體電路、光電半導體等元件，依照設計密封於一小的空間內，來發揮最佳的工作效能。元件構裝將是未來發展高精密攜帶式微電子及光電產品的主要核心技術，本課程將介紹構裝設計、及其相關技術、與工業現況。 | |||
| 英文概述 English Description | Electronic packaging technology is the techniques to encapsulate the chips and optoelectronic devices into a small volume with protective materials, mounted with other components in hybrid or multichip modules, or connected directly onto a printed circuit board. It will be one of the important technologies on developing the portable electronic and optoelectronic products. This course will introduce the basis of package design, related package technologies and current industry status. | |||
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