| 課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
|---|---|---|---|---|
| B303004 | 半導體製程技術實習 | Semiconductor manufacturing technology Lab. | 1.0 | 3 |
| 中文概述 Chinese Description | 本實習課旨在讓學生透過進入本校既有半導體製程教學場域，內容包括晶圓清洗、光阻塗佈、光學曝光、顯影製程、薄膜製作、金屬薄膜沉積、電鍍、化學機械平坦拋光製程、蝕刻製程、晶圓切割及薄膜量測與製程紀錄等基本操作。同時導入安全管理、場域操作規範與設備使用流程，使學生熟悉製程環境並具備初步操作能力，建立學生理論與實務操作的連結。 | |||
| 英文概述 English Description | This lab course is designed to provide students with hands-on experience in the semiconductor manufacturing environment available on campus. Students will engage in fundamental process operations, including wafer cleaning, photoresist coating, optical lithography exposure, development, thin-film fabrication, metal film deposition, electroplating, chemical mechanical planarization (CMP), etching processes, wafer dicing, thin-film characterization, and process documentation. The course also incorporates safety management, facility operation protocols, and equipment usage procedures to ensure that students become familiar with the fabrication environment and acquire essential operational skills. Through this training, students will be able to establish a strong connection between theoretical knowledge and practical semiconductor process operation. | |||
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