| 課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
|---|---|---|---|---|
| B203009 | 半導體材料分析實習 | Semiconductor Materials Analysis Lab. | 1.0 | 3 |
| 中文概述 Chinese Description | 本實習課程著重培養學生半導體材料分析的實作技能。透過親手操作X射線繞射儀(XRD)、掃描電子顯微鏡(SEM)、能量散佈光譜儀(EDS)、原子力顯微鏡(AFM)等精密儀器，學習樣品製備、儀器校正、量測參數設定及數據處理技巧。實驗內容包含矽晶圓表面分析、薄膜厚度量測、晶粒大小計算、點/線缺陷密度評估及元素組成分析。每次實驗均要求撰寫完整報告，培養學生科學寫作能力。結合產業實際樣品分析，強化學生就業競爭力。 | |||
| 英文概述 English Description | This laboratory course emphasizes hands-on training in semiconductor materials analysis techniques. Students gain practical experience operating X-ray diffractometer (XRD), scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and atomic force microscope (AFM). Training covers sample preparation, instrument calibration, measurement parameter optimization, and data processing procedures. Laboratory experiments include silicon wafer surface analysis, thin film thickness measurement, grain size calculation, point/linear defect density evaluation, and elemental composition analysis. Comprehensive lab reports are required to develop scientific writing skills. Integration of real industrial samples enhances students' employability and practical problem-solving capabilities in semiconductor manufacturing. | |||
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