| 課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
|---|---|---|---|---|
| B203008 | 半導體材料分析 | Semiconductor Materials Analysis | 3.0 | 3 |
| 中文概述 Chinese Description | 本課程核心為培養學生對半導體材料特性分析的專業能力。課程涵蓋半導體物理基礎、晶體結構與缺陷分析、電子能帶理論及載子傳輸機制。重點介紹X射線繞射(XRD)、掃描電子顯微鏡(SEM)、穿透電子顯微鏡(TEM)、光譜分析技術(XPS、AES、FTIR)等先進分析儀器操作與數據判讀。結合實務案例探討矽、化合物半導體及新興二維材料的製程監控與品質評估，培養學生具備半導體產業所需的材料分析與問題解決能力。 | |||
| 英文概述 English Description | This course develops students' expertise in semiconductor materials characterization and analysis. Topics include semiconductor physics fundamentals, crystal structures and defect analysis, electronic band theory, and carrier transport mechanisms. Emphasis on advanced analytical techniques including X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), and spectroscopic methods (XPS, AES, FTIR). Students learn instrument operation and data interpretation through hands-on experience. Case studies cover silicon, compound semiconductors, and emerging 2D materials for process monitoring and quality assessment, preparing students for careers in semiconductor industry with essential materials analysis and problem-solving skills. | |||
備註：