| 課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
|---|---|---|---|---|
| 5605104 | 半導體與載板異質整合技術概論 | Introduction to Semiconductor and Heterogeneous Integration Technologies | 3.0 | 3 |
| 中文概述 Chinese Description | 本課程介紹半導體產業與異質整合技術之基本原理、關鍵製程及產業應用，內容涵蓋電子構裝架構、封裝的製程及材料、載板製程技術、先進封裝與異質整合技術、熱管理需求、綠色製造與永續發展。課程將結合理論基礎與產業實務問題，透過實際產業案例，使學生了解半導體與載板技術的發展趨勢在人工智慧高效能運算與電子產品中的應用。 | |||
| 英文概述 English Description | This course introduces the fundamental principles, key processes, and industrial applications of the semiconductor industry and heterogeneous integration technologies. Topics include electronic packaging architectures, packaging processes and materials, package substrate manufacturing technologies, advanced packaging and heterogeneous integration, thermal management, green manufacturing, and sustainable development. The course integrates theoretical foundations with practical industrial challenges and uses real-world industry cases to help students understand the development trends and applications of semiconductor and substrate technologies in artificial intelligence, high-performance computing (HPC), and electronic products. | |||
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