| 課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
|---|---|---|---|---|
| 4005933 | 企業實務講座-半導體製程與設備 | Business Lecture-Semiconductor Process and Equipment | 3.0 | 3 |
| 中文概述 Chinese Description | 本課程主要學習各企業在半導體製程的各關鍵製程，包括晶圓製造、蝕刻及封裝測試等，同時深入探討最先進的半導體製造設備。透過與業界專家交流，使學生了解產業實務案例，並掌握應對半導體產業人才需求。率先引領台灣半導體產業發展以真實具體的企業經驗為教材，進而鼓勵學生追求半導體科技創新的渴望，強化學生對職涯願景的規劃。 | |||
| 英文概述 English Description | This course focuses on studying the key processes of various companies in the semiconductor manufacturing process, including wafer manufacturing, etching, packaging, and testing, etc., and also provides an in-depth discussion of the most advanced semiconductor manufacturing equipment. Through exchanges with industry experts, students can understand industrial practical cases and master the talent needs of the semiconductor industry. It takes the lead in leading the development of Taiwan's semiconductor industry by using real and concrete corporate experience as teaching materials, thereby encouraging students to pursue semiconductor technology innovation and strengthening students' career vision planning. | |||
備註：