| 課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
|---|---|---|---|---|
| 3205017 | 半導體構裝技術 | Semiconductor Packaging Technology | 3.0 | 3 |
| 中文概述 Chinese Description | 半導體構裝技術是將積體電路和其它電元件，依設計聯結在一系統中，再以構裝材料將晶片、基座及釘架封包。本課程將介紹陶瓷構裝和高分子構裝、及其相關技術、與工業現況。 | |||
| 英文概述 English Description | Semiconductor packaging is to allow the chips be incorporated into an individual protective package, mounted with other components in hybrid or multichip modules, or connected directly onto a printed circuit board. This course will introduce both ceramic packaging and polymer packaging and their corresponding technology. | |||
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