Course Syllabus

Course Information：

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Spring Semester Year 2025	345376	Advanced Semiconductor Device Manufacturing and Physics	1	3.0	3	★	Hung Ying Chieh	4CEB4A 4CEB4B 4CEB4C	20	0	大四化工所合開

Course Plan：

Instructor	Hung Ying Chieh　Office Hours
Email	hungyc@ntut.edu.tw
Last Updated	2024-12-20 17:12:53
Course Objective	本課程之目的在於介紹一些廣泛、基本及實際的半導體製造程序（其中最主要者為積體電路之製造程序）。 一、半導體基礎知識 1.1 半導體材料和性質 - 摻雜物質和半導體的導電性 - 能隙和能帶結構 1.2 基本的半導體器件 - 晶體二極體（Diode） - 金屬氧化物半導體場效應電晶體（MOSFET） 二、半導體製程步驟 2.1 前端製程 - 晶圓製備 - 形成氧化層 - 光阻和光刻技術 - 擴散和離子佈植 2.2 中後段製程 - 金屬化和化學機械研磨（CMP） - 絕緣層和封裝 - 測試和製程控制 三、先進製程技術 3.1 先進製程的發展趨勢 3.2 三維製程技術 3.3 極紫外線（EUV）製程 四、製程模擬和製程控制 4.1 製程模擬工具的應用 4.2 製程監控和優化 4.3 製程變異性和缺陷控制 五、產業應用與趨勢 5.1 半導體產業概況 5.2 新興應用領域 5.3 綠色製程和可持續性 I. Semiconductor Fundamentals 1.1 Semiconductor Materials and Properties Dopant Materials and Semiconductor Conductivity Energy Band Gap and Band Structure 1.2 Basic Semiconductor Devices Crystal Diode (Diode) Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) II. Semiconductor Manufacturing Steps 2.1 Front-End Processing Wafer Preparation Oxide Layer Formation Photoresist and Photolithography Techniques Diffusion and Ion Implantation 2.2 Middle-Back-End Processing Metallization and Chemical Mechanical Polishing (CMP) Insulation Layer and Packaging Testing and Process Control III. Advanced Manufacturing Technologies 3.1 Trends in Advanced Manufacturing 3.2 Three-Dimensional Manufacturing Technology 3.3 Extreme Ultraviolet (EUV) Manufacturing Process IV. Process Simulation and Control 4.1 Application of Process Simulation Tools 4.2 Process Monitoring and Optimization 4.3 Process Variability and Defect Control V. Industry Applications and Trends 5.1 Over
Course Schedule	Week 1 I. Semiconductor Fundamentals 1.1 Semiconductor Materials and Properties Dopant Materials and Semiconductor Conductivity Energy Band Gap and Band Structure Week 2 Basic Semiconductor Devices Crystal Diode (Diode) Week 3 Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) & Physics Week 4 Semiconductor Manufacturing Steps 2.1 Front-End Processing Wafer Preparation Oxide Layer Formation Week 5 Photoresist and Photolithography Techniques Week 6 Diffusion and Ion Implantation 2.2 Middle-Back-End Processing Week 7 Metallization and Chemical Mechanical Polishing (CMP) Week 8 Insulation Layer and Packaging Week 9 Midterm Week 10 Testing and Process Control & Process Monitoring and Optimization & Defect Control III. Advanced Manufacturing Technologies Week 11 Trends in Advanced Manufacturing 3.2 Three-Dimensional Manufacturing Technology Week 12 Extreme Ultraviolet (EUV) Manufacturing Process IV. Process Simulation and Control Week 13 Application of Process Simulation Tools V. Industry Applications and Trends Week 14 Overview of the Semiconductor Industry Week 15 Presentation I Week 16 Presentation II Week 17 Presentation III Week 18 Final Exam
Evaluation and grading policy	25% Midterm 25% Final Exam 50 % Presentation
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:No 半導體製程技術導論(第四版) 蕭宏
The access to curricular consultation	Email: hungyc@ntut.edu.tw
The course corresponds to the SDGs	SDG1：消除貧窮（No Poverty） SDG3：良好健康和福祉（Good Health and Well-being） SDG4：優質教育（Quality Education） SDG10：減少不平等（Reduced Inequalities）
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