Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Spring Semester
Year 2024 331641 Introduction to semiconductor manufacturing technology 1 3.0 3 ★ Mei-Hsin Chen GEOE
IEECSG 18 2 光電所和電資外生所合開

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Spring Semester Year 2024	331641	Introduction to semiconductor manufacturing technology	1	3.0	3	★	Mei-Hsin Chen	GEOE IEECSG	18	2	光電所和電資外生所合開

Course Plan：

Instructor Mei-Hsin Chen　Office Hours

Email mhchen@mail.ntut.edu.tw

Last Updated 2024-05-22 16:32:30

Course Objective 導論、積體電路生產介紹、半導體基礎、晶圓製造、加熱製程、微影蝕刻、電漿的基礎原理、離子佈植、化學氣相沉積與介電質薄膜、金屬化製程、化學機械研磨、製程整合、CMOS 製程 Introduction、Introduction to IC Fabrication、Semiconductor Basics、 Wafer Manufacturing、Thermal Processes、Photolithography and Etch、 Plasma Basics、Ion Implantation、CVD and Dielectric Thin Film、 Metallization、CMP 、Process Integration、CMOS Processes

Course Schedule Introduction to IC Fabrication ( 1 week ) Semiconductor Basics ( 2 weeks ) Wafer Manufacturing ( 1 week ) Thermal Processes ( 2 weeks ) Photolithography and Etch ( 1 week ) Plasma Basics ( 2 weeks ) Ion Implantation ( 1 week ) CVD and Dielectric Thin Film ( 2 weeks ) Metallization ( 1 week ) CMP ( 1 week ) Process Integration ( 1 week ) CMOS Processes ( 1 week )

Evaluation and grading policy Attendance : 10 % Midterm: 30 % ( close book ) Final term：30 % (close book ) Presentation：30 % (15 minutes presentation per person)

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:Yes
Introduction to semiconductor manufacturing technology

The access to curricular consultation We will be at the same classroom (Everlight building 935) on the 17th, 18th week.

The course corresponds to the SDGs

Note
We will be at the same classroom (Everlight building 935) on the 17th, 18th week.

Instructor	Mei-Hsin Chen　Office Hours
Email	mhchen@mail.ntut.edu.tw
Last Updated	2024-05-22 16:32:30
Course Objective	導論、積體電路生產介紹、半導體基礎、晶圓製造、加熱製程、微影蝕刻、電漿的基礎原理、離子佈植、化學氣相沉積與介電質薄膜、金屬化製程、化學機械研磨、製程整合、CMOS 製程 Introduction、Introduction to IC Fabrication、Semiconductor Basics、 Wafer Manufacturing、Thermal Processes、Photolithography and Etch、 Plasma Basics、Ion Implantation、CVD and Dielectric Thin Film、 Metallization、CMP 、Process Integration、CMOS Processes
Course Schedule	Introduction to IC Fabrication ( 1 week ) Semiconductor Basics ( 2 weeks ) Wafer Manufacturing ( 1 week ) Thermal Processes ( 2 weeks ) Photolithography and Etch ( 1 week ) Plasma Basics ( 2 weeks ) Ion Implantation ( 1 week ) CVD and Dielectric Thin Film ( 2 weeks ) Metallization ( 1 week ) CMP ( 1 week ) Process Integration ( 1 week ) CMOS Processes ( 1 week )
Evaluation and grading policy	Attendance : 10 % Midterm: 30 % ( close book ) Final term：30 % (close book ) Presentation：30 % (15 minutes presentation per person)
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:Yes Introduction to semiconductor manufacturing technology
The access to curricular consultation	We will be at the same classroom (Everlight building 935) on the 17th, 18th week.
The course corresponds to the SDGs
Note	We will be at the same classroom (Everlight building 935) on the 17th, 18th week.