Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Spring Semester
Year 2024 331521 Manufacturing Processes 1 3.0 3 ★ Jay Huang 4IEM2A 42 1 EMI

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Spring Semester Year 2024	331521	Manufacturing Processes	1	3.0	3	★	Jay Huang	4IEM2A	42	1	EMI

Course Plan：

Instructor Jay Huang　Office Hours

Email jayhuang@ntut.edu.tw

Last Updated 2024-05-17 11:19:33

Course Objective 本課程旨在使學生瞭解科技業各種製造的方法和程序，內容包含:半導體製造、微電子封裝、表面黏著技術裝、印刷電路板PCB製造、面板製程、統計製程管制 This course is intended to provide a comprehensive study of the Modern manufacturing processes .The course is designed principally to provide the following topics: Semiconductor manufacturing Electronics packaging Surface mount technology PCB manufacturing Panel manufacturing Statistical process control

Course Schedule w1~3 Semiconductor manufacturing半導體製造 w4~6 Electronics packaging微電子封裝 w7~9 Surface mount technology表面黏著技術 w10~11 PCB manufacturing印刷電路板PCB製造 w12~14 Panel manufacturing面板製程 w15~16 Statistical process control統計製程管制 w 17~18 Term report

Evaluation and grading policy Attendance 40% Midterm 30% Term report 30% Class participation: extra bonus

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:No
Self-made materials

The access to curricular consultation i school
e-mail：jayhuang@mail.ntut.edu.tw
line ID：0955304120
Facebook：jayhuang@ntut.edu.tw
線上教學規劃：第17、18周使用microsoft teams連結
會議連結: https://teams.live.com/meet/9541078424892?p=9aWUHYvOcs7TFGvSIL

The course corresponds to the SDGs

Note
e-mail：jayhuang@mail.ntut.edu.tw
line ID：0955304120
Facebook：jayhuang@ntut.edu.tw
線上教學規劃：第17、18周使用microsoft teams連結
會議連結: https://teams.live.com/meet/9541078424892?p=9aWUHYvOcs7TFGvSIL

Instructor	Jay Huang　Office Hours
Email	jayhuang@ntut.edu.tw
Last Updated	2024-05-17 11:19:33
Course Objective	本課程旨在使學生瞭解科技業各種製造的方法和程序，內容包含:半導體製造、微電子封裝、表面黏著技術裝、印刷電路板PCB製造、面板製程、統計製程管制 This course is intended to provide a comprehensive study of the Modern manufacturing processes .The course is designed principally to provide the following topics: Semiconductor manufacturing Electronics packaging Surface mount technology PCB manufacturing Panel manufacturing Statistical process control
Course Schedule	w1~3 Semiconductor manufacturing半導體製造 w4~6 Electronics packaging微電子封裝 w7~9 Surface mount technology表面黏著技術 w10~11 PCB manufacturing印刷電路板PCB製造 w12~14 Panel manufacturing面板製程 w15~16 Statistical process control統計製程管制 w 17~18 Term report
Evaluation and grading policy	Attendance 40% Midterm 30% Term report 30% Class participation: extra bonus
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:No Self-made materials
The access to curricular consultation	i school e-mail：jayhuang@mail.ntut.edu.tw line ID：0955304120 Facebook：jayhuang@ntut.edu.tw 線上教學規劃：第17、18周使用microsoft teams連結會議連結: https://teams.live.com/meet/9541078424892?p=9aWUHYvOcs7TFGvSIL
The course corresponds to the SDGs
Note	e-mail：jayhuang@mail.ntut.edu.tw line ID：0955304120 Facebook：jayhuang@ntut.edu.tw 線上教學規劃：第17、18周使用microsoft teams連結會議連結: https://teams.live.com/meet/9541078424892?p=9aWUHYvOcs7TFGvSIL