Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Fall Semester
Year 2026 363920 Packaging Technology 1 3.0 3 ★ Tran Dinh Phuc GMT
IMMA 0 0 製科、外生專班合開，限25人，英文授課

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Fall Semester Year 2026	363920	Packaging Technology	1	3.0	3	★	Tran Dinh Phuc	GMT IMMA	0	0	製科、外生專班合開，限25人，英文授課

Course Plan：

Instructor Tran Dinh Phuc　Office Hours

Email dptran@ntut.edu.tw

Last Updated 2026-06-04 20:57:41

Course Objective This course will teach the fundamentals for packaging, including phase diagrams of solders, bonding technology, metallurgical reactions, and reliabilities, as well as the state-of-the-art Cu-Cu hybrid bonding. It will also cover bonding technology of microelectronic packaging: Die Attach/Chip Bond, Wire Bond, Tape automatic bonding, Flip Chip Technology, Pb-based and Pb-free Solders, Microbumps, 3D IC packaging, Cu-Cu bonding, and Cu hybrid bonding. Metallurgical reactions include Cu-Sn, Ni-Sn, Sn-Au, Ag-Sn, Pd-Sn, and In-Sn. The following reliability issues will be taught: multiple reflow, electromigration, thermomigration, Stress, temperature cycling tests, solid state aging, Sn whisker, and Mean-time-to-failure measurement.

Course Schedule The teacher expects each chapter to be finished weekly. 1st Introduction: Phase diagrams, 2nd handout: Chip-level interconnection-Wire bonding 2nd Wire bonding, 3rd handout: Die attach & Leadframe, 4th TAB; Surface Finishes 5th Metallurgical Reaction (I) bulk samples 6th Metallurgical Reaction (II) Thin Films & FCT Reliability 7th Pb-based and Pb-free solders, 8th Metallurgical Reaction (III); 8th Reliability Issues of Pb-free Solder Joints, 9th Metallurgical Reaction (IV): 9th Cross reactions and massive spalling 10th Metallurgical Reaction (V): 10th Effect of Solder Volume on Metallurgical 11th reactions and reliabilities of solder joints/microbumps. 12th Electromigration I: EM in Al, Cu and Solder lines 13th Electromigration II: EM in Solder joints; Electromigration III: Void formation, current and temperature redistribution. 14th Thermomigration 15th Advanced packaging. EM & TM in microbumps; 16th 3D IC Packaging; Cu-Cu bonding. 16th 3D IC Packaging; Cu-Cu bonding. 17th 3D IC Packaging; Cu/SiO2 hybrid bonding. 18th 3D IC Packaging; Cu/ SiO2 hybrid bonding.

Evaluation and grading policy Midterm: 20% Class Attendance: 20% Journal paper critique and presentation: 30% Final: 30%

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:No
1. K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging Science and Engineering, Wiley 2021. 2. K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability (Springer 2007)

The access to curricular consultation Students might have access to curricular consultation from the advisor to get advice about courses or academic planning.

Expanding teaching and resources ● 參與式創新教學 (Participatory & Innovative Teaching)
強調學生參與與產出，導入翻轉、PBL/專題、設計思考或遊戲化等策略。
Emphasizes student engagement and outcomes by adopting strategies such as Flipped Classroom, PBL (Problem/Project- Based Learning), Design Thinking, or Gamification.

The course corresponds to the SDGs SDG9：產業創新與基礎設施（Industry, Innovation and Infrastructure）

Does the course incorporate AI ● 使用生成式AI作為教學過程的輔助工具（Use generative AI tools as an aid to the teaching process）
● 鼓勵學生使用生成式AI工具（Encourage students to use generative AI tools）

Note
　

Instructor	Tran Dinh Phuc　Office Hours
Email	dptran@ntut.edu.tw
Last Updated	2026-06-04 20:57:41
Course Objective	This course will teach the fundamentals for packaging, including phase diagrams of solders, bonding technology, metallurgical reactions, and reliabilities, as well as the state-of-the-art Cu-Cu hybrid bonding. It will also cover bonding technology of microelectronic packaging: Die Attach/Chip Bond, Wire Bond, Tape automatic bonding, Flip Chip Technology, Pb-based and Pb-free Solders, Microbumps, 3D IC packaging, Cu-Cu bonding, and Cu hybrid bonding. Metallurgical reactions include Cu-Sn, Ni-Sn, Sn-Au, Ag-Sn, Pd-Sn, and In-Sn. The following reliability issues will be taught: multiple reflow, electromigration, thermomigration, Stress, temperature cycling tests, solid state aging, Sn whisker, and Mean-time-to-failure measurement.
Course Schedule	The teacher expects each chapter to be finished weekly. 1st Introduction: Phase diagrams, 2nd handout: Chip-level interconnection-Wire bonding 2nd Wire bonding, 3rd handout: Die attach & Leadframe, 4th TAB; Surface Finishes 5th Metallurgical Reaction (I) bulk samples 6th Metallurgical Reaction (II) Thin Films & FCT Reliability 7th Pb-based and Pb-free solders, 8th Metallurgical Reaction (III); 8th Reliability Issues of Pb-free Solder Joints, 9th Metallurgical Reaction (IV): 9th Cross reactions and massive spalling 10th Metallurgical Reaction (V): 10th Effect of Solder Volume on Metallurgical 11th reactions and reliabilities of solder joints/microbumps. 12th Electromigration I: EM in Al, Cu and Solder lines 13th Electromigration II: EM in Solder joints; Electromigration III: Void formation, current and temperature redistribution. 14th Thermomigration 15th Advanced packaging. EM & TM in microbumps; 16th 3D IC Packaging; Cu-Cu bonding. 16th 3D IC Packaging; Cu-Cu bonding. 17th 3D IC Packaging; Cu/SiO2 hybrid bonding. 18th 3D IC Packaging; Cu/ SiO2 hybrid bonding.
Evaluation and grading policy	Midterm: 20% Class Attendance: 20% Journal paper critique and presentation: 30% Final: 30%
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:No 1. K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging Science and Engineering, Wiley 2021. 2. K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability (Springer 2007)
The access to curricular consultation	Students might have access to curricular consultation from the advisor to get advice about courses or academic planning.
Expanding teaching and resources	● 參與式創新教學 (Participatory & Innovative Teaching) 強調學生參與與產出，導入翻轉、PBL/專題、設計思考或遊戲化等策略。 Emphasizes student engagement and outcomes by adopting strategies such as Flipped Classroom, PBL (Problem/Project- Based Learning), Design Thinking, or Gamification.
The course corresponds to the SDGs	SDG9：產業創新與基礎設施（Industry, Innovation and Infrastructure）
Does the course incorporate AI	● 使用生成式AI作為教學過程的輔助工具（Use generative AI tools as an aid to the teaching process） ● 鼓勵學生使用生成式AI工具（Encourage students to use generative AI tools）
Note