Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Spring Semester
Year 2026 356188 Advanced Integrated Circuit Fabrication Process 1 3.0 3 ★ Tran Dinh Phuc GME 9 0 限25人，甲、乙組選修

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Spring Semester Year 2026	356188	Advanced Integrated Circuit Fabrication Process	1	3.0	3	★	Tran Dinh Phuc	GME	9	0	限25人，甲、乙組選修

Course Plan：

Instructor Tran Dinh Phuc　Office Hours

Email dptran@ntut.edu.tw

Last Updated 2025-12-18 08:43:10

Course Objective Study the state of the art of the IC fabrication processes, including heating, ion implant, PVD, CVD, lithograph, etching of the front-end processes and packaging and testing of back-end processes. The trends of the processes, the relationship of the processes with the physics of the devices and the process integrating technology will also be taught in this course. The fundamentals for advanced semiconductor packaging will be provided.

Course Schedule The teacher expects each chapter to be finished weekly, but the schedule is flexible.

Evaluation and grading policy Midterm: 25% Class Attendance: 20% Term paper, Journal paper critique (2): 30% Final: 25%

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:No
K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging, Science and Engineering, Wiley 2021.

The access to curricular consultation Students might have access to curricular consultation from the advisor to get advice about courses or academic planning.

The course corresponds to the SDGs 無（None）

Does the course incorporate AI ● 無（None）

Note
　

Instructor	Tran Dinh Phuc　Office Hours
Email	dptran@ntut.edu.tw
Last Updated	2025-12-18 08:43:10
Course Objective	Study the state of the art of the IC fabrication processes, including heating, ion implant, PVD, CVD, lithograph, etching of the front-end processes and packaging and testing of back-end processes. The trends of the processes, the relationship of the processes with the physics of the devices and the process integrating technology will also be taught in this course. The fundamentals for advanced semiconductor packaging will be provided.
Course Schedule	The teacher expects each chapter to be finished weekly, but the schedule is flexible.
Evaluation and grading policy	Midterm: 25% Class Attendance: 20% Term paper, Journal paper critique (2): 30% Final: 25%
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:No K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging, Science and Engineering, Wiley 2021.
The access to curricular consultation	Students might have access to curricular consultation from the advisor to get advice about courses or academic planning.
The course corresponds to the SDGs	無（None）
Does the course incorporate AI	● 無（None）
Note