Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Fall Semester
Year 2025 352569 Packaging Technology 1 3.0 3 ★ Tran Dinh Phuc GMT 12 0 　

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Fall Semester Year 2025	352569	Packaging Technology	1	3.0	3	★	Tran Dinh Phuc	GMT	12	0

Course Plan：

Instructor Tran Dinh Phuc　Office Hours

Email dptran@ntut.edu.tw

Last Updated 2025-09-15 18:48:10

Course Objective This course will teach the fundamentals for packaging, including phase diagrams of solders, bonding technology, metallurgical reactions, and reliabilities, as well as the state-of-the-art Cu-Cu hybrid bonding. It will also cover bonding technology of microelectronic packaging: Die Attach/Chip Bond, Wire Bond, Tape automatic bonding, Flip Chip Technology, Pb-based and Pb-free Solders, Microbumps, 3D IC packaging, Cu-Cu bonding, and Cu hybrid bonding. Metallurgical reactions include Cu-Sn, Ni-Sn, Sn-Au, Ag-Sn, Pd-Sn, and In-Sn. The following reliability issues will be taught: multiple reflow, electromigration, thermomigration, Stress, temperature cycling tests, solid state aging, Sn whisker, and Mean-time-to-failure measurement.

Course Schedule The teacher expects each chapter to be finished weekly, but the schedule is flexible.

Evaluation and grading policy Two Midterms: 30% Class Attendance (10-12 weeks): 20% Term paper, Journal paper critique (2): 30% Final: 20%

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:Yes
1. K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging Science and Engineering, Wiley 2021. 2. K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability (Springer 2007)

The access to curricular consultation Students might have access to curricular consultation from the advisor to get advice about courses or academic planning.

Expanding teaching and resources

The course corresponds to the SDGs SDG9：產業創新與基礎設施（Industry, Innovation and Infrastructure）

Does the course incorporate AI ● 無（None）

Note
　

Instructor	Tran Dinh Phuc　Office Hours
Email	dptran@ntut.edu.tw
Last Updated	2025-09-15 18:48:10
Course Objective	This course will teach the fundamentals for packaging, including phase diagrams of solders, bonding technology, metallurgical reactions, and reliabilities, as well as the state-of-the-art Cu-Cu hybrid bonding. It will also cover bonding technology of microelectronic packaging: Die Attach/Chip Bond, Wire Bond, Tape automatic bonding, Flip Chip Technology, Pb-based and Pb-free Solders, Microbumps, 3D IC packaging, Cu-Cu bonding, and Cu hybrid bonding. Metallurgical reactions include Cu-Sn, Ni-Sn, Sn-Au, Ag-Sn, Pd-Sn, and In-Sn. The following reliability issues will be taught: multiple reflow, electromigration, thermomigration, Stress, temperature cycling tests, solid state aging, Sn whisker, and Mean-time-to-failure measurement.
Course Schedule	The teacher expects each chapter to be finished weekly, but the schedule is flexible.
Evaluation and grading policy	Two Midterms: 30% Class Attendance (10-12 weeks): 20% Term paper, Journal paper critique (2): 30% Final: 20%
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:Yes 1. K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging Science and Engineering, Wiley 2021. 2. K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability (Springer 2007)
The access to curricular consultation	Students might have access to curricular consultation from the advisor to get advice about courses or academic planning.
Expanding teaching and resources
The course corresponds to the SDGs	SDG9：產業創新與基礎設施（Industry, Innovation and Infrastructure）
Does the course incorporate AI	● 無（None）
Note