Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Fall Semester
Year 2025 346756 Integrated Circuit Fabrication Process 1 3.0 3 ★ JHE-YU LIN
LIN HWAI EN 4ME4A
4ME4B 36 4 機械四合開；限40人

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Fall Semester Year 2025	346756	Integrated Circuit Fabrication Process	1	3.0	3	★	JHE-YU LIN LIN HWAI EN	4ME4A 4ME4B	36	4	機械四合開；限40人

Course Plan：

Instructor JHE-YU LIN　Office Hours

Email linjy@mail.ntut.edu.tw

Last Updated 2025-05-23 10:16:55

Course Objective 先修課程：負責教授同意。半導體材料及IC製造流程。如物理沈積(PVD)、化學沈積(CVD)、高溫處理、微影、蝕刻及其相關設備介紹、廠物、維修、管理及工安等。IC封裝及測試。 Introduction to semiconductor material, diode, transistor, logic IC and memory IC, etc. description of the operation principles technology and related facilities about semiconductor fabrication processes, such as Physical vapor deposition (PVD), chemical vapor deposition (CVD), doping , oxidation , heat process, lithography , and etching etc., discussion of utilities, maintenance, management and industrial safety in the factory. Discussion of IC packaging and testing.

Course Schedule 第10周基礎製程介紹第11周矽晶片製造第12周加熱製程/擴散製程第13周曝光顯影第14周蝕刻製程/離子佈植第15周化學氣相沉積與介電質薄膜第16周封裝及整合第17周分析測試第18周期末考

Evaluation and grading policy 課堂參與及作業 15％期末考 35％

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:No
半導體製程概論(第四版) ISBN：9789865035228 半導體製程技術導論(第三版) ISBN：9789572195758

The access to curricular consultation linjy@mail.ntut.edu.tw

Expanding teaching and resources

The course corresponds to the SDGs SDG9：產業創新與基礎設施（Industry, Innovation and Infrastructure）
SDG12：負責任的消費與生產（Responsible Consumption and Production）

Does the course incorporate AI ● 使用生成式AI作為教學過程的輔助工具（Use generative AI tools as an aid to the teaching process）

Note
　

Instructor	JHE-YU LIN　Office Hours
Email	linjy@mail.ntut.edu.tw
Last Updated	2025-05-23 10:16:55
Course Objective	先修課程：負責教授同意。半導體材料及IC製造流程。如物理沈積(PVD)、化學沈積(CVD)、高溫處理、微影、蝕刻及其相關設備介紹、廠物、維修、管理及工安等。IC封裝及測試。 Introduction to semiconductor material, diode, transistor, logic IC and memory IC, etc. description of the operation principles technology and related facilities about semiconductor fabrication processes, such as Physical vapor deposition (PVD), chemical vapor deposition (CVD), doping , oxidation , heat process, lithography , and etching etc., discussion of utilities, maintenance, management and industrial safety in the factory. Discussion of IC packaging and testing.
Course Schedule	第10周基礎製程介紹第11周矽晶片製造第12周加熱製程/擴散製程第13周曝光顯影第14周蝕刻製程/離子佈植第15周化學氣相沉積與介電質薄膜第16周封裝及整合第17周分析測試第18周期末考
Evaluation and grading policy	課堂參與及作業 15％期末考 35％
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:No 半導體製程概論(第四版) ISBN：9789865035228 半導體製程技術導論(第三版) ISBN：9789572195758
The access to curricular consultation	linjy@mail.ntut.edu.tw
Expanding teaching and resources
The course corresponds to the SDGs	SDG9：產業創新與基礎設施（Industry, Innovation and Infrastructure） SDG12：負責任的消費與生產（Responsible Consumption and Production）
Does the course incorporate AI	● 使用生成式AI作為教學過程的輔助工具（Use generative AI tools as an aid to the teaching process）
Note