Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Spring Semester
Year 2026 354010 Special subjects for intelligent factory (II) 1 3.0 3 ★ LEE,YEE-TING
Yuan-Jen Chang
Tseng, Shih-Feng 4ME3A
4ME3B 40 0 機械三甲和機械三乙合開

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Spring Semester Year 2026	354010	Special subjects for intelligent factory (II)	1	3.0	3	★	LEE,YEE-TING Yuan-Jen Chang Tseng, Shih-Feng	4ME3A 4ME3B	40	0	機械三甲和機械三乙合開

Course Plan：

Instructor Tseng, Shih-Feng　Office Hours

Email tsf@ntut.edu.tw

Last Updated 2025-12-19 11:40:58

Course Objective 本課程設計的是鏈結AOI與雷射加工產業，與智能廠接軌共同來解決產業實際應產業之問題與需求。設計課程分成三階段，分別為課程講授、業師實作討論、業師實務專題，三階段前後銜接，循序漸進課程讓學全接觸AOI與雷射加工技術。第一部分課程講授主要為基礎之理論傳授，訂立實驗目標、計畫實驗過程、課後評量，予以教學反饋；第二部分實作與討論，採讓學進雷射相關的實驗設計與操作，融會貫通所學理論，培育其實作技能，藉由組與業師討論，練習規劃實驗，實驗安排由簡入深，從認識機台種類系統之光路架設、最終參數的調整等，並藉由組討論記錄表，予以教學回饋；第三部分為企業命題之實務專題，請業師提供產業實務問題，並由產業負責專題內容，讓學了解前業界發展向、業界現況與製程瓶頸等，將理論課程更實務鏈結到雷射應，期末進實務成果發表展與評選，培育其解決實務問題之能。 The first part of the course, classroom instruction, primarily focuses on imparting foundational theory, setting experimental objectives, planning the experimental process, conducting post-assessments, and providing instructional feedback. The second part involves hands-on practical work and discussions. Students engage in experimental design and operations related to laser technology, integrating the theoretical knowledge acquired earlier. Through group discussions with industry experts, they learn to plan experiments, starting with understanding different types of machinery, optical path configurations, and parameter adjustments. Discussion records are used to provide instructional feedback. The third part consists of practical projects based on industry propositions. Industry experts present real-world industry problems, and students work on projects related to these topics. This segment allows students to gain insights into industry trends, current industry conditions, and manufact

Course Schedule 第12週 5/15 實驗 PBL總整課程：半導體探針卡之超快雷射鑽孔曾釋 教授第13週 5/22 實驗 PBL總整課程：半導體探針卡之超快雷射鑽孔曾釋 教授第14週 5/29 實驗 PBL總整課程：半導體探針卡之超快雷射鑽孔曾釋 教授

Evaluation and grading policy 出席率：20% 報告或考試：80%

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:No
自編教材

The access to curricular consultation 綜科館423室每週二12:00-16:00

Expanding teaching and resources

The course corresponds to the SDGs SDG9：產業創新與基礎設施（Industry, Innovation and Infrastructure）
SDG12：負責任的消費與生產（Responsible Consumption and Production）

Does the course incorporate AI ● 無（None）

Note
　

Instructor	Tseng, Shih-Feng　Office Hours
Email	tsf@ntut.edu.tw
Last Updated	2025-12-19 11:40:58
Course Objective	本課程設計的是鏈結AOI與雷射加工產業，與智能廠接軌共同來解決產業實際應產業之問題與需求。設計課程分成三階段，分別為課程講授、業師實作討論、業師實務專題，三階段前後銜接，循序漸進課程讓學全接觸AOI與雷射加工技術。第一部分課程講授主要為基礎之理論傳授，訂立實驗目標、計畫實驗過程、課後評量，予以教學反饋；第二部分實作與討論，採讓學進雷射相關的實驗設計與操作，融會貫通所學理論，培育其實作技能，藉由組與業師討論，練習規劃實驗，實驗安排由簡入深，從認識機台種類系統之光路架設、最終參數的調整等，並藉由組討論記錄表，予以教學回饋；第三部分為企業命題之實務專題，請業師提供產業實務問題，並由產業負責專題內容，讓學了解前業界發展向、業界現況與製程瓶頸等，將理論課程更實務鏈結到雷射應，期末進實務成果發表展與評選，培育其解決實務問題之能。 The first part of the course, classroom instruction, primarily focuses on imparting foundational theory, setting experimental objectives, planning the experimental process, conducting post-assessments, and providing instructional feedback. The second part involves hands-on practical work and discussions. Students engage in experimental design and operations related to laser technology, integrating the theoretical knowledge acquired earlier. Through group discussions with industry experts, they learn to plan experiments, starting with understanding different types of machinery, optical path configurations, and parameter adjustments. Discussion records are used to provide instructional feedback. The third part consists of practical projects based on industry propositions. Industry experts present real-world industry problems, and students work on projects related to these topics. This segment allows students to gain insights into industry trends, current industry conditions, and manufact
Course Schedule	第12週 5/15 實驗 PBL總整課程：半導體探針卡之超快雷射鑽孔曾釋 教授第13週 5/22 實驗 PBL總整課程：半導體探針卡之超快雷射鑽孔曾釋 教授第14週 5/29 實驗 PBL總整課程：半導體探針卡之超快雷射鑽孔曾釋 教授
Evaluation and grading policy	出席率：20% 報告或考試：80%
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:No 自編教材
The access to curricular consultation	綜科館423室每週二12:00-16:00
Expanding teaching and resources
The course corresponds to the SDGs	SDG9：產業創新與基礎設施（Industry, Innovation and Infrastructure） SDG12：負責任的消費與生產（Responsible Consumption and Production）
Does the course incorporate AI	● 無（None）
Note