Course Syllabus

Course Information：

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Spring Semester Year 2025	345534	Technology of Laser Material Processing	1	3.0	3	★	Tseng, Shih-Feng	GMT 半導體學位學程	33	3	限25人,製科所和半導體碩班合開

Course Plan：

Instructor	Tseng, Shih-Feng　Office Hours
Email	tsf@ntut.edu.tw
Last Updated	2024-12-16 20:01:12
Course Objective	先修課程：負責教授同意 介紹雷射加工之理論及實務，注重製程參數之研究，教導學生如何掌握製程，以達到精密製造的要求。內容包括雷射輔助製造程序、雷射加工設備、雷射加工原理、系統分析、實驗設計、雷射加工實例。 Introducing theory and practice of laser material processing. Emphasizing the study of manufacturing factors. Letting the students know how to control manufacturing process, and fulfill the demand of precision manufacturing. The course content is : laser assisted manufacturing processes, facilities for laser material processing, the principles of laser material processing, system analysis, examples of laser material processing.
Course Schedule	週次(Week) 課程描述(Course description) 1 雷射切割玻璃基板製程技術探討 (Technical investigations of laser cutting process on glass substrates ) 2 雷射切割玻璃基板製程技術探討 (Technical investigations of laser cutting process on glass substrates ) 3 雷射切割玻璃基板製程技術探討 (Technical investigations of laser cutting process on glass substrates ) 4 雷射切割玻璃基板製程技術探討 (Technical investigations of laser cutting process on glass substrates ) 5 二氧化碳雷射熔切加工介紹 (Introduction of melting cutting process using carbon dioxide laser) 6 二氧化碳雷射熔切加工介紹 (Introduction of melting cutting process using carbon dioxide laser) 7 二氧化碳雷射熔切加工介紹 (Introduction of melting cutting process using carbon dioxide laser) 8 二氧化碳雷射熔切加工介紹 (Introduction of melting cutting process using carbon dioxide laser) 9 Mid-term exam 10 雷射鑽孔機與其關鍵技術簡介 (Introduction of laser drilling machine and its key technology) 11 雷射鑽孔機與其關鍵技術簡介 (Introduction of laser drilling machine and its key technology) 12 雷射鑽孔機與其關鍵技術簡介 (Introduction of laser drilling machine and its key technology) Paper review and oral report 13 Paper review and oral report 14 光纖雷射加工系統練習 (Fiber laser processing system practices) 15 光纖雷射加工系統練習 (Fiber laser processing system practices) 16 UV雷射加工系統練習 (UV laser processing system practices) 17 UV雷射加工系統練習 (UV laser processing system practices) Final project presentation 18 Final project presentation
Evaluation and grading policy	1. Mid-term exam: 50% 2. Paper review and oral report: 25% 3. Final project oral report: 25%
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:No Self-made teaching materials
The access to curricular consultation	聯絡方式：E-mail: tsf@ntut.edu.tw 討論地點：綜科館423室
Expanding teaching and resources
The course corresponds to the SDGs	SDG8：尊嚴就業與經濟發展（Decent Work and Economic Growth） SDG9：產業創新與基礎設施（Industry, Innovation and Infrastructure）
Does the course incorporate AI
Note	聯絡方式：E-mail: tsf@ntut.edu.tw; 分機：2043 上課及討論網址：https://meet.google.com/yqd-aiha-qit