Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Fall Semester
Year 2025 348852 Semiconductor molecular materials and fabrication testing 1 2.0 2 ★ Lee Yi-huan
Lin,Chun-Che 4MSE1
4ET1 105 4 分子一和工程一合開

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Fall Semester Year 2025	348852	Semiconductor molecular materials and fabrication testing	1	2.0	2	★	Lee Yi-huan Lin,Chun-Che	4MSE1 4ET1	105	4	分子一和工程一合開

Course Plan：

Instructor Lee Yi-huan　Office Hours

Email yihuanlee@ntut.edu.tw

Last Updated 2025-05-28 13:58:12

Course Objective 本課程分為三大重點：(1) 製程涵蓋：半導體基礎原理、晶圓製造、加熱製程、蝕刻製程、化學氣相沉積、金屬化製程、製程整合技術。(2) 分析涵蓋：晶相結構分析、奈米3D顯微形貌表面形態分析、原子力顯微鏡。(3) 業界講師共同授課並分享產業為來發展趨勢。 The course is divided into three main points: (1) The fabrication: basic principles of semiconductor, wafer manufacturing, heating process, etching process, chemical vapor deposition, metallization process, and process integration technology. (2) Analysis: crystal structure analysis, nano 3D micro-topography and surface morphology analysis, atomic force microscope. (3) Industry lecturers teach and share industry trends in the future.

Course Schedule 1. (1st week) 導論 2. (2nd and 3rd weeks) 半導體分子材料-1 3. (4th and 5th weeks) 半導體分子材料-2 4. (6th and 7th weeks) 半導體製程與應用-1 5. (8th week) 半導體製程與應用-2 (9th week) Mid-term Exam 7. (10th and 11th week) 分析技術與應用-1 8. (12th and 13th weeks) 分析技術與應用-2 9. (14th week) 業界實務講習 10. (15th week) 業界實務講習 11. (16th week) 業界實務講習 12 (17th week) 業界實務講習 (18th week) Final Exam

Evaluation and grading policy 期中考 40% 期末考 40% 出席與作業成績 20%

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:Yes
1. 半導體製造技術與管理 (簡富; 清華大學出版) 2. Handbook of Microscopy for Nanotechnology (N. Yao and Z. L. Wang; KLUWER ACADEMIC PUBLISHERS)

The access to curricular consultation 若有任何有關此課程的問題，請寄信至: yihuanlee@mail.ntut.edu.tw

Expanding teaching and resources

The course corresponds to the SDGs 無（None）

Does the course incorporate AI ● 無（None）

Note
　

Instructor	Lee Yi-huan　Office Hours
Email	yihuanlee@ntut.edu.tw
Last Updated	2025-05-28 13:58:12
Course Objective	本課程分為三大重點：(1) 製程涵蓋：半導體基礎原理、晶圓製造、加熱製程、蝕刻製程、化學氣相沉積、金屬化製程、製程整合技術。(2) 分析涵蓋：晶相結構分析、奈米3D顯微形貌表面形態分析、原子力顯微鏡。(3) 業界講師共同授課並分享產業為來發展趨勢。 The course is divided into three main points: (1) The fabrication: basic principles of semiconductor, wafer manufacturing, heating process, etching process, chemical vapor deposition, metallization process, and process integration technology. (2) Analysis: crystal structure analysis, nano 3D micro-topography and surface morphology analysis, atomic force microscope. (3) Industry lecturers teach and share industry trends in the future.
Course Schedule	1. (1st week) 導論 2. (2nd and 3rd weeks) 半導體分子材料-1 3. (4th and 5th weeks) 半導體分子材料-2 4. (6th and 7th weeks) 半導體製程與應用-1 5. (8th week) 半導體製程與應用-2 (9th week) Mid-term Exam 7. (10th and 11th week) 分析技術與應用-1 8. (12th and 13th weeks) 分析技術與應用-2 9. (14th week) 業界實務講習 10. (15th week) 業界實務講習 11. (16th week) 業界實務講習 12 (17th week) 業界實務講習 (18th week) Final Exam
Evaluation and grading policy	期中考 40% 期末考 40% 出席與作業成績 20%
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:Yes 1. 半導體製造技術與管理 (簡富; 清華大學出版) 2. Handbook of Microscopy for Nanotechnology (N. Yao and Z. L. Wang; KLUWER ACADEMIC PUBLISHERS)
The access to curricular consultation	若有任何有關此課程的問題，請寄信至: yihuanlee@mail.ntut.edu.tw
Expanding teaching and resources
The course corresponds to the SDGs	無（None）
Does the course incorporate AI	● 無（None）
Note