Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Fall Semester
Year 2026 362966 Semiconductor molecular materials and fabrication testing 1 2.0 2 ★ Lee Yi-huan
Lin,Chun-Che 4MSE1
4ET1 6 0 分子一和工程一合開，80人教室

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Fall Semester Year 2026	362966	Semiconductor molecular materials and fabrication testing	1	2.0	2	★	Lee Yi-huan Lin,Chun-Che	4MSE1 4ET1	6	0	分子一和工程一合開，80人教室

Course Plan：

Instructor Lin,Chun-Che　Office Hours

Email cclin0530@ntut.edu.tw

Last Updated 2026-06-21 16:54:22

Course Objective 本課程分為三大重點：(1) 製程涵蓋：半導體基礎原理、晶圓製造、加熱製程、蝕刻製程、化學氣相沉積、金屬化製程、製程整合技術。(2) 分析涵蓋：晶相結構分析、奈米3D顯微形貌表面形態分析、原子力顯微鏡。(3) 業界講師共同授課並分享產業為來發展趨勢。 The course is divided into three main points: (1) The fabrication: basic principles of semiconductor, wafer manufacturing, heating process, etching process, chemical vapor deposition, metallization process, and process integration technology. (2) Analysis: crystal structure analysis, nano 3D micro-topography and surface morphology analysis, atomic force microscope. (3) Industry lecturers teach and share industry trends in the future.

Course Schedule 第1週 (9/7-9/11, 2026) 導論第2週 (9/14-9/18, 2026) 半導體分子材料-1 第3週 (9/21-9/25, 2026) 半導體分子材料-2 第4週 (9/28-10/2, 2026) 化學氣相沉積-1 第5週 (10/5-10/9, 2026) 化學氣相沉積-2 第6週 (10/12-10/16, 2026) 半導體製程與應用-1 第7週 (10/19-10/23, 2026) 半導體製程與應用-2 第8週 (10/26-10/30, 2026) 期中考第9週 (11/2-11/6, 2026) 業界實務講習第10週 (11/9-11/13, 2026) 蝕刻製程-1 第11週 (11/16-11/20, 2026) 蝕刻製程-2 第12週 (11/23-11/27, 2026) 分析技術與應用-1 第13週 (11/30-12/4, 2026) 分析技術與應用-2 第14週 (12/7-12/11, 2026) 製程整合技術-1 第15週 (12/14-12/18, 2026) 製程整合技術-2 第16週 (12/21-12/25, 2026) 期末考第17週 (12/28-1/1, 2027) 業界實務講習第18週 (1/4-1/8, 2027) 半導體材料課程心得報告

Evaluation and grading policy Class attendance and homework (20%) Midterm exam (40%) Final Exam (40%)

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:Yes
1. 半導體製造技術與管理 (簡富; 清華大學出版) 2. Handbook of Microscopy for Nanotechnology (N. Yao and Z. L. Wang; KLUWER ACADEMIC PUBLISHERS) 3. 業師自備課程

The access to curricular consultation (1) 教師諮商時間Office Hours
(Monday: 13:00 ~ 15:00; Wednesday: 13:00 ~ 15:00; Thursday: 13:00 ~ 15:00)
(2) e-mail
(3) 視訊video

Expanding teaching and resources ● 參與式創新教學 (Participatory & Innovative Teaching)
強調學生參與與產出，導入翻轉、PBL/專題、設計思考或遊戲化等策略。
Emphasizes student engagement and outcomes by adopting strategies such as Flipped Classroom, PBL (Problem/Project- Based Learning), Design Thinking, or Gamification.
● 數位教材資源應用 (Application of Digital Resources)
採用影音多媒體或具開放授權之資源（如OCW、開放教科書）作為主要或輔助教材。
Adopts multimedia or open-licensed resources (e.g., OCW, Open Textbooks) as primary or supplementary teaching materials.

The course corresponds to the SDGs SDG8：尊嚴就業與經濟發展（Decent Work and Economic Growth）

Does the course incorporate AI ● 使用生成式AI作為教學過程的輔助工具（Use generative AI tools as an aid to the teaching process）
● 鼓勵學生使用生成式AI工具（Encourage students to use generative AI tools）
● 簡單介紹AI的基本概念（Briefly introduce the basic concept of AI）

Note
　

Instructor	Lin,Chun-Che　Office Hours
Email	cclin0530@ntut.edu.tw
Last Updated	2026-06-21 16:54:22
Course Objective	本課程分為三大重點：(1) 製程涵蓋：半導體基礎原理、晶圓製造、加熱製程、蝕刻製程、化學氣相沉積、金屬化製程、製程整合技術。(2) 分析涵蓋：晶相結構分析、奈米3D顯微形貌表面形態分析、原子力顯微鏡。(3) 業界講師共同授課並分享產業為來發展趨勢。 The course is divided into three main points: (1) The fabrication: basic principles of semiconductor, wafer manufacturing, heating process, etching process, chemical vapor deposition, metallization process, and process integration technology. (2) Analysis: crystal structure analysis, nano 3D micro-topography and surface morphology analysis, atomic force microscope. (3) Industry lecturers teach and share industry trends in the future.
Course Schedule	第1週 (9/7-9/11, 2026) 導論第2週 (9/14-9/18, 2026) 半導體分子材料-1 第3週 (9/21-9/25, 2026) 半導體分子材料-2 第4週 (9/28-10/2, 2026) 化學氣相沉積-1 第5週 (10/5-10/9, 2026) 化學氣相沉積-2 第6週 (10/12-10/16, 2026) 半導體製程與應用-1 第7週 (10/19-10/23, 2026) 半導體製程與應用-2 第8週 (10/26-10/30, 2026) 期中考第9週 (11/2-11/6, 2026) 業界實務講習第10週 (11/9-11/13, 2026) 蝕刻製程-1 第11週 (11/16-11/20, 2026) 蝕刻製程-2 第12週 (11/23-11/27, 2026) 分析技術與應用-1 第13週 (11/30-12/4, 2026) 分析技術與應用-2 第14週 (12/7-12/11, 2026) 製程整合技術-1 第15週 (12/14-12/18, 2026) 製程整合技術-2 第16週 (12/21-12/25, 2026) 期末考第17週 (12/28-1/1, 2027) 業界實務講習第18週 (1/4-1/8, 2027) 半導體材料課程心得報告
Evaluation and grading policy	Class attendance and homework (20%) Midterm exam (40%) Final Exam (40%)
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:Yes 1. 半導體製造技術與管理 (簡富; 清華大學出版) 2. Handbook of Microscopy for Nanotechnology (N. Yao and Z. L. Wang; KLUWER ACADEMIC PUBLISHERS) 3. 業師自備課程
The access to curricular consultation	(1) 教師諮商時間Office Hours (Monday: 13:00 ~ 15:00; Wednesday: 13:00 ~ 15:00; Thursday: 13:00 ~ 15:00) (2) e-mail (3) 視訊video
Expanding teaching and resources	● 參與式創新教學 (Participatory & Innovative Teaching) 強調學生參與與產出，導入翻轉、PBL/專題、設計思考或遊戲化等策略。 Emphasizes student engagement and outcomes by adopting strategies such as Flipped Classroom, PBL (Problem/Project- Based Learning), Design Thinking, or Gamification. ● 數位教材資源應用 (Application of Digital Resources) 採用影音多媒體或具開放授權之資源（如OCW、開放教科書）作為主要或輔助教材。 Adopts multimedia or open-licensed resources (e.g., OCW, Open Textbooks) as primary or supplementary teaching materials.
The course corresponds to the SDGs	SDG8：尊嚴就業與經濟發展（Decent Work and Economic Growth）
Does the course incorporate AI	● 使用生成式AI作為教學過程的輔助工具（Use generative AI tools as an aid to the teaching process） ● 鼓勵學生使用生成式AI工具（Encourage students to use generative AI tools） ● 簡單介紹AI的基本概念（Briefly introduce the basic concept of AI）
Note