Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Spring Semester
Year 2026 359728 Semiconductor Process Integration 1 3.0 3 ★ CHUNG-KUANG YANG GCEB
IDEOM 8 0 網路預選限15人；化工所EOMP合開

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Spring Semester Year 2026	359728	Semiconductor Process Integration	1	3.0	3	★	CHUNG-KUANG YANG	GCEB IDEOM	8	0	網路預選限15人；化工所EOMP合開

Course Plan：

Instructor CHUNG-KUANG YANG　Office Hours

Email ckyang@ntut.edu.tw

Last Updated 2025-12-17 16:05:06

Course Objective 本課程係將整合個別半導體製造單元，併同現有半導體產業與未來發展趨勢的分析介紹，再輔以積體電路元件的設計原理，期使學生具備從製程、設備、元件原理等各方面獲得半導體製程的整合性觀念。 In this class, the semiconductor fabrication process is treated as a set of specified units. Incorporating the semiconductor industry and its future development trends, the knowledge of semiconductor theory and the fabrication details of each unit were integrated. The students will acquire comprehensive knowledge of semiconductor fabrication processes and device theories.

Course Schedule (1) Semiconductor Industry overview (2)(3) IC Fundamentals/ IC Design (4) Fabrication of Si Wafer (5) (6) Chemical Vapor Deposition (7) (8) Physical Vapor Deposition (9) Mid-term examination (10) (11) Doping technology (thermal and ion implantation) (12) (13) Photolithograph (14) (15) Characterization techniques for semiconductor material properties (16) (17) IC Testing techniques (18) Final examination

Evaluation and grading policy 45% Midterm exam 45% Final examination 10% Quiz and Reports

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:Yes
Text books: (1) Semiconductor Devices: Physics and Technology, 3rd Edition, Simon M. Sze, Ming-Kwei Lee (2) Semiconductor Manufacturing Technology, Prentice Hall, 1st edition (November 19, 2000), Michael Quirk

The access to curricular consultation Discussion in the class or use Microsoft Team

The course corresponds to the SDGs SDG12：負責任的消費與生產（Responsible Consumption and Production）

Does the course incorporate AI ● 鼓勵學生使用生成式AI工具（Encourage students to use generative AI tools）

Note
　

Instructor	CHUNG-KUANG YANG　Office Hours
Email	ckyang@ntut.edu.tw
Last Updated	2025-12-17 16:05:06
Course Objective	本課程係將整合個別半導體製造單元，併同現有半導體產業與未來發展趨勢的分析介紹，再輔以積體電路元件的設計原理，期使學生具備從製程、設備、元件原理等各方面獲得半導體製程的整合性觀念。 In this class, the semiconductor fabrication process is treated as a set of specified units. Incorporating the semiconductor industry and its future development trends, the knowledge of semiconductor theory and the fabrication details of each unit were integrated. The students will acquire comprehensive knowledge of semiconductor fabrication processes and device theories.
Course Schedule	(1) Semiconductor Industry overview (2)(3) IC Fundamentals/ IC Design (4) Fabrication of Si Wafer (5) (6) Chemical Vapor Deposition (7) (8) Physical Vapor Deposition (9) Mid-term examination (10) (11) Doping technology (thermal and ion implantation) (12) (13) Photolithograph (14) (15) Characterization techniques for semiconductor material properties (16) (17) IC Testing techniques (18) Final examination
Evaluation and grading policy	45% Midterm exam 45% Final examination 10% Quiz and Reports
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:Yes Text books: (1) Semiconductor Devices: Physics and Technology, 3rd Edition, Simon M. Sze, Ming-Kwei Lee (2) Semiconductor Manufacturing Technology, Prentice Hall, 1st edition (November 19, 2000), Michael Quirk
The access to curricular consultation	Discussion in the class or use Microsoft Team
The course corresponds to the SDGs	SDG12：負責任的消費與生產（Responsible Consumption and Production）
Does the course incorporate AI	● 鼓勵學生使用生成式AI工具（Encourage students to use generative AI tools）
Note