Course Syllabus

Course Information：

Year-Semester Course Number Course Name Phase Credits Hours Required/Elective Instructor Class Student NO. Withdraw Note

Fall Semester
Year 2020 280355 Semiconductor Packaging Technology 1 3.0 3 ★ CHUNG-KUANG YANG GCEB
IDEOM 18 1 ◎

Year-Semester	Course Number	Course Name	Phase	Credits	Hours	Required/Elective	Instructor	Class	Student NO.	Withdraw	Note
Fall Semester Year 2020	280355	Semiconductor Packaging Technology	1	3.0	3	★	CHUNG-KUANG YANG	GCEB IDEOM	18	1	◎

Course Plan：

Instructor CHUNG-KUANG YANG

Email ckyang@ntut.edu.tw

Last Updated 2020-06-12 15:28:48

Course Objective 半導體構裝技術是將積體電路和其它電元件，依設計聯結在一系統中，再以構裝材料將晶片、基座及釘架封包。本課程將介紹陶瓷構裝和高分子構裝、及其相關技術、與工業現況。 Semiconductor packaging is to allow the chips be incorporated into an individual protective package, mounted with other components in hybrid or multichip modules, or connected directly onto a printed circuit board. This course will introduce both ceramic packaging and polymer packaging and their corresponding technology. It covers the topics in any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection, and radiation heat transfer; thermo-mechanical failures and reliability; advanced packaging materials at micro and nanoscales; ceramic, organic, glass, and silicon substrates.

Course Schedule Week 1-2 Microelectronics Packaging—An Overview Week 3-5 Ceramic packaging Week 6-8 Polymers in packaging Week 9 Mid-term examination Week 10-12 Thin-film packaging Week 13-15 Package Sealing and Encapsulation Week 16-17 Advanced packaging in micro and nanoscales Week 18 Final examination

Evaluation and grading policy Mid-term examination 50% Fianl examination 50%

Materials All right reserved. Do not reproduce without permission.

Foreign-language textbooks:Yes
1. Fundamentals of Microsystems Packaging, Tummala, Rao, 2018 (2nd ed) 2. Microelectronics Packaging Handbook: semiconductor packaging, Tummala, Rao, Rymaszewski, Eugene J., Klopfenstein, Alan G., 1997

The access to curricular consultation

Expanding teaching and resources

The course corresponds to the SDGs

Does the course incorporate AI

Note
　

Instructor	CHUNG-KUANG YANG
Email	ckyang@ntut.edu.tw
Last Updated	2020-06-12 15:28:48
Course Objective	半導體構裝技術是將積體電路和其它電元件，依設計聯結在一系統中，再以構裝材料將晶片、基座及釘架封包。本課程將介紹陶瓷構裝和高分子構裝、及其相關技術、與工業現況。 Semiconductor packaging is to allow the chips be incorporated into an individual protective package, mounted with other components in hybrid or multichip modules, or connected directly onto a printed circuit board. This course will introduce both ceramic packaging and polymer packaging and their corresponding technology. It covers the topics in any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection, and radiation heat transfer; thermo-mechanical failures and reliability; advanced packaging materials at micro and nanoscales; ceramic, organic, glass, and silicon substrates.
Course Schedule	Week 1-2 Microelectronics Packaging—An Overview Week 3-5 Ceramic packaging Week 6-8 Polymers in packaging Week 9 Mid-term examination Week 10-12 Thin-film packaging Week 13-15 Package Sealing and Encapsulation Week 16-17 Advanced packaging in micro and nanoscales Week 18 Final examination
Evaluation and grading policy	Mid-term examination 50% Fianl examination 50%
Materials	All right reserved. Do not reproduce without permission. Foreign-language textbooks:Yes 1. Fundamentals of Microsystems Packaging, Tummala, Rao, 2018 (2nd ed) 2. Microelectronics Packaging Handbook: semiconductor packaging, Tummala, Rao, Rymaszewski, Eugene J., Klopfenstein, Alan G., 1997
The access to curricular consultation
Expanding teaching and resources
The course corresponds to the SDGs
Does the course incorporate AI
Note