Course Description

Course CodeCourse NameCreditsHours
7305082 Semiconductor and Microelectronic Packaging Technology 2.0 2
Description Semiconductor chip packaging and microelectronic packaging is the critical technology to allow the chips be incorporated into an individual protective package, mounted with other components in hybrid or multichip modules, or connected directly onto a printed circuit board. This course will introduce both ceramic packaging and polymer packaging and their corresponding technology.