| Description
| The lecture describes packaging technology as a summary of those technological methods, which use joining of two or more electronic, micro-mechanic micro-optic or other components like this by force, soldering or welding processes. Besides the presentation of these processes, the parts, i.e. thin film circuit elements, thick film components, including their material and technology relevant properties such as mechanical, heat transfer, electromagnetic interference, which influence the packaging reliability are described. Examples such as die bonding, wire bonding, flip-chip bonding adhesive technology and soldering technology are chosen to show joining technology for semiconductor, MEM components, hybrid CKTs, packages and modules.
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