| Description
| This laboratory course emphasizes hands-on training in semiconductor materials analysis techniques. Students gain practical experience operating X-ray diffractometer (XRD), scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and atomic force microscope (AFM). Training covers sample preparation, instrument calibration, measurement parameter optimization, and data processing procedures. Laboratory experiments include silicon wafer surface analysis, thin film thickness measurement, grain size calculation, point/linear defect density evaluation, and elemental composition analysis. Comprehensive lab reports are required to develop scientific writing skills. Integration of real industrial samples enhances students' employability and practical problem-solving capabilities in semiconductor manufacturing.
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