| Description
| This lab course is designed to provide students with hands-on experience in the semiconductor manufacturing environment available on campus.
Students will engage in fundamental process operations, including wafer cleaning, photoresist coating, optical lithography exposure, development, thin-film fabrication, metal film deposition, electroplating, chemical mechanical planarization (CMP), etching processes, wafer dicing, thin-film characterization, and process documentation.
The course also incorporates safety management, facility operation protocols, and equipment usage procedures to ensure that students become familiar with the fabrication environment and acquire essential operational skills. Through this training, students will be able to establish a strong connection between theoretical knowledge and practical semiconductor process operation.
|
|---|