教學大綱與進度

課程基本資料：

學年期	課號	課程名稱	階段	學分	時數	修	教師	班級	人	撤	備註
112-2	331157	半導體構裝技術	1	2.0	2	★	楊重光	化工所 能源光電外國學生專班	8	0	網路預選限15人(研究所)；化工所EOMP合開

教學大綱與進度：

教師姓名	楊重光　教師諮商時間(Office Hours)
Email	ckyang@ntut.edu.tw
最後更新時間	2023-12-11 15:31:56
課程大綱	半導體構裝技術是將積體電路和其它電元件，依設計聯結在一系統中，再以構裝材料將晶片、基座及釘架封包。本課程將介紹陶瓷構裝和高分子構裝、及其相關技術、與工業現況。 Semiconductor packaging facilitates the chips be incorporated into an individual protective package, mounted with other components in hybrid or multi-chip modules, or connected directly onto a printed circuit board. This course will introduce both ceramic packaging and polymer packaging and their corresponding technology. It covers the topics in any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection, and radiation heat transfer; thermo-mechanical failures and reliability; advanced packaging materials at micro and nano-scales; ceramic, organic, glass, and silicon substrates.
課程進度	Week 1-2 Microelectronics Packaging—An Overview Week 3-5 Ceramic packaging Week 6-8 Polymers in packaging Week 9 Mid-term examination Week 10-12 Thin-film packaging Week 13-15 Package Sealing and Encapsulation Week 16-17 Advanced packaging in micro and nanoscales Week 18 Final examination
評量方式與標準	Mid-term examination 50% Fianl examination 50%
使用教材、參考書目或其他	【遵守智慧財產權觀念，請使用正版教科書，不得使用非法影印教科書】 使用外文原文書：是 1. Fundamentals of Microsystems Packaging, Tummala, Rao, 2018 (2nd ed) 2. Microelectronics Packaging Handbook: semiconductor packaging, Tummala, Rao, Rymaszewski, Eugene J., Klopfenstein, Alan G., 1997
課程諮詢管道	email ckyang@ntut.edu.tw
備註	非同步可填寫使用教學全都錄，請由北科i學園PLUS上線觀看，若是全面停課則採同步教學採Microsoft Teams。