教學大綱與進度
課程基本資料:
學年期
課號
課程名稱
階段
學分
時數
修
教師
班級
人
撤
備註
99-1
142185
半導體製造技術
1
3.0
3
★
胡心卉
電通所
20
0
教學大綱與進度:
教師姓名
胡心卉
Email
hhhu@ntut.edu.tw
最後更新時間
2010-08-23 12:43:46
課程大綱
1.Introduction to Semiconductor Engineering 2.Semiconductor Fundamental 3.Wafer Manufacturing 4.Cleanroom, Clearn and Gettering 5.Thermal Oxidation 6.Diffusion 7.Ion Implantation 8.Etching 9.Deposition 10.Lithography 11.Back-End Process 12.COMS Preocess
課程進度
1.Introduction to Semiconductor Engineering 2.Semiconductor Fundamental 3.Semiconductor Fundamental 4.Wafer Manufacturing 5.Cleanroom, Clearn and Gettering 6.Thermal Oxidation 7.Diffusion 8.Ion Implantation 9.Mid-term Exam 10.Etching 11.Deposition 12.Deposition 13.Lithography 14.Lithography 15.Back-End Process 16.COMS Preocess 17.COMS Preocess 18.Final Exam
評量方式與標準
Homework (1/3) Midterm (1/3) Final Exam (1/3)
使用教材、參考書目或其他
【遵守智慧財產權觀念,請使用正版教科書,不得使用非法影印教科書】
使用外文原文書:
[1] Hong Xiao, “Introduction to Semiconductor Manufacturing Technology”, 2000, Prentice Hall [2] James D. Plummer, M. D. Deal, and P. B. Griffin, “Silicon VLSI Technology-Fundamentals, Practice and Modeling”, 2000, Prentice Hall. [3] Stanley Wolf and Richard N. Tauber “Silicon Processing for the VLSI ERA, Volume1: Process Technology”, 1986, Lattice Press. [4] W. R. Runyan and K. E. Bean “Semiconductor Integrated Circuit Processing Technology”, 1990, Addison-Wesley. [5] James W. Mayer and Sylvanus S. Lau “Electronic Materials Science: For Integrated Circuits in SI and GaAs”, 1989, Prentice Hall.
課程諮詢管道
備註