課 程 概 述
Course Description

課程編碼
Course Code
中文課程名稱
Course Name (Chinese)
英文課程名稱
Course Name (English)
總學分數
Credits
總時數
Hours
7305049 半導體製程整合技術 Semiconductor Process Integration 3.0 3
中文概述
Chinese Description
本課程係將個別半導體製造程序視為獨立單元,運用化工單元操作的概念,併同現有半導體產業與未來發展趨勢的分析介紹,再輔以積體電路元件的設計原理,期使具化工背景人員能從製程、設備、元件原理等各方面取得一對半導體製程的整合性觀念。 課程內容: (1)產業概覽 (2)積體電路基本技術背景 (3)積體電路設計 (4)積體電路製造 (5)內連線RC延遲電路與放大電路 (6)金屬化製程技術 (7)平坦化製程技術 (8)物理氣相沉積與化學氣相沉積技術 (9)線層/阻障層/種晶層 (10)金屬填充/金屬互連(0.5~0.18um) (11)銅製程整合(0.13um含以上) (12)基極/位元線路/電容器 (13)積體電路製程相關設備
英文概述
English Description
In this class, the specified semiconductor process is considered as specified unit. By use of the concepts which belong to the chemical engineering unit operations to interpret the analysis / introduction in semiconductor industry and future developing trending. (Also including the theories of VLSI devices) The students who have studied professional chemical engineering courses for many years, can acquire completed and integrated viewpoints in semiconductor process. (Including processes; apparatuses and theories of devices) 1. Industry overview 2. IC Fundamentals 3. IC Design 4. IC Fabrication 5. Interconnect RC Delay vs Scaling 6. Metallization technology 7. Planarization technology 8. PVD and CVD Technology 9. Liner/Barrier/Seed (0.5-0.18um) 10. Metal Fill/ Metal Interconnect (0.5-0.18um) 11. Cu Integration (0.13um and beyond) 12. Gate/Bit Line/Capacitor 13. IC Equipments

備註:

  1. 本資料係由本校各教學單位、教務處課務組、進修部教務組、進修學院教務組及計網中心所共同提供!
  2. 本資料僅供參考,正式資料仍以教務處、進修部、進修學院所公佈之書面資料為準。