| 課程編碼 Course Code | 中文課程名稱 Course Name (Chinese) | 英文課程名稱 Course Name (English) | 總學分數 Credits | 總時數 Hours |
|---|---|---|---|---|
| 5605010 | 封裝技術 | Packaging Technology | 3.0 | 3 |
| 中文概述 Chinese Description | 先修課程：負責教授同意。 封裝技術論及相關技術方法，如施力、軟焊、或熔接等用來將兩個或多個微電子、微機械、微光學或其他相關元件結合的技術原理及製程。內容也涉及被封裝的元件的材料及封裝可靠度有關的特性如力學、熱傳、電磁干擾等。案例包括黏晶、打線、覆晶、黏著技術及軟焊技術等。 | |||
| 英文概述 English Description | The lecture describes packaging technology as a summary of those technological methods, which use joining of two or more electronic, micro-mechanic micro-optic or other components like this by force, soldering or welding processes. Besides the presentation of these processes, the parts, i.e. thin film circuit elements, thick film components, including their material and technology relevant properties such as mechanical, heat transfer, electromagnetic interference, which influence the packaging reliability are described. Examples such as die bonding, wire bonding, flip-chip bonding adhesive technology and soldering technology are chosen to show joining technology for semiconductor, MEM components, hybrid CKTs, packages and modules. | |||
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